Thin Film Adhesion Characterization by Microwedge Scratching of Precracked Fine Lines
- 1 January 1994
- journal article
- Published by Springer Nature in MRS Proceedings
Abstract
No abstract availableKeywords
This publication has 5 references indexed in Scilit:
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- High Resolution Tungsten Patterning Using Buffered, Mildly Basic Etching SolutionsJournal of the Electrochemical Society, 1975