Grain boundary and interdiffusion studies in compound semiconductor thin films and devices utilizing Auger electron spectroscopy and secondary ion mass spectroscopy
- 1 February 1979
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 57 (1), 99-106
- https://doi.org/10.1016/0040-6090(79)90413-9
Abstract
No abstract availableKeywords
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