A study of interdiffusion in multilayer Cu/Ni films by Auger electron depth profiling
- 1 March 1982
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 89 (2), 221-224
- https://doi.org/10.1016/0040-6090(82)90452-7
Abstract
No abstract availableThis publication has 10 references indexed in Scilit:
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