TAB Versus Wire Bond-Relative Thermal Performance
- 1 December 1985
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 8 (4), 490-499
- https://doi.org/10.1109/tchmt.1985.1136538
Abstract
No abstract availableKeywords
This publication has 5 references indexed in Scilit:
- New Applications of Tape Bonding for High Lead Count DevicesPublished by ASTM International ,1984
- Thermal Studies on Pin Grid Array Packages for High Density LSI and VLSI Logic CircuitsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1983
- Thermal Design Studies of a High-Current Transistor PackageIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1982
- Thermal Characteristics of 16- and 40-Pin Plastic DIP'sIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1981
- Heat transfer analysis of beam-lead transistor chipIEEE Transactions on Electron Devices, 1970