Characteristics of n+ polycrystalline-Si/Al2O3/Si metal–oxide– semiconductor structures prepared by atomic layer chemical vapor deposition using Al(CH3)3 and H2O vapor
- 1 June 2001
- journal article
- research article
- Published by AIP Publishing in Journal of Applied Physics
- Vol. 89 (11), 6275-6280
- https://doi.org/10.1063/1.1368869
Abstract
We report interface and dielectric reliability characteristics of polycrystalline-silicon (poly-Si)/ metal–oxide–semiconductor (MOS) capacitors. films were prepared by atomic layer chemical vapor deposition using and vapor. Interface state density and dielectric reliability properties of poly- MOS structures were examined by capacitance–voltage, conductance, current–voltage, and time-dependent dielectric breakdown measurements. The of the poly- MOS system near the Si midgap is approximately as determined by the conductance method. Frequency dispersion as small as ∼20 mV and hysteresis of ∼15 mV were attained under the electric field of ±8 MV/cm. The gate leakage current of ∼36 Å effective thickness dielectric measured at the gate voltage of −2.5 V is ∼−5 nA/cm2, which is approximately three orders of magnitude lower than that of a controlled oxide Time-dependent dielectric breakdown data of MOS capacitors under the constant current/voltage stress reveal excellent charge-to-breakdown characteristics over controlled oxide. Reliable gate oxide integrity of gate dielectric is manifested by the excellent distribution of gate oxide breakdown voltage on 128 million MOS capacitors having isolation edges. Extracted time constant and capture cross section of the junction are discussed.
Keywords
This publication has 11 references indexed in Scilit:
- Local transport and trapping issues in Al2O3 gate oxide structuresApplied Physics Letters, 2000
- Atomic Layer Deposition of Oxide Thin Films with Metal Alkoxides as Oxygen SourcesScience, 2000
- High-resolution depth profiling in ultrathin Al2O3 films on SiApplied Physics Letters, 2000
- Stable zirconium silicate gate dielectrics deposited directly on siliconApplied Physics Letters, 2000
- Electrical properties of hafnium silicate gate dielectrics deposited directly on siliconApplied Physics Letters, 1999
- Control of the Slope of Field Oxide Edge and Its Effects on Gate Oxide ReliabilityJournal of the Electrochemical Society, 1999
- Intermixing at the tantalum oxide/silicon interface in gate dielectric structuresApplied Physics Letters, 1998
- A Novel High K Inter-poly Dielectric(IPD), A1/sub 2/O/sub 3/ For Low Voltage/high Speed Flash memories: erasing in msecs at 3.3VPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1997
- Thermodynamic stability of binary oxides in contact with siliconJournal of Materials Research, 1996
- Sequential surface chemical reaction limited growth of high quality Al2O3 dielectricsApplied Physics Letters, 1989