Interfacial chemistry effects on the adhesion of sputter-deposited TiC films to steel substrates
- 1 November 1982
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 97 (1), 79-89
- https://doi.org/10.1016/0040-6090(82)90419-9
Abstract
No abstract availableThis publication has 10 references indexed in Scilit:
- Residual compressive stress in sputter-deposited TiC films on steel substratesThin Solid Films, 1981
- Mechanisms of the reactive- and chemical-sputter deposition of TiO2 from Ti and TiC targets in mixed Ar+O2 dischargesJournal of Applied Physics, 1979
- The nature of the transition region formed between dc-bases rf sputtered TiC films and steel substratesSurface Science, 1978
- Adhesion of sputter-deposited carbide films to steel substratesThin Solid Films, 1976
- Influence of Ar sputtering pressure on the adhesion of TiC films to steel substratesJournal of Vacuum Science and Technology, 1975
- A technique for detecting critical loads in the scratch test for thin film adhesionReview of Scientific Instruments, 1974
- Temperature Rise during Film Deposition by rf and dc SputteringJournal of Vacuum Science and Technology, 1972
- Transition-metal carbidesProgress in Solid State Chemistry, 1971
- The Stress Field Created by a Circular Sliding ContactJournal of Applied Mechanics, 1966
- Some factors influencing the adhesion of films produced by vacuum evaporationJournal de Physique et le Radium, 1950