Non-metal hermetic encapsulation of a hybrid circuit
- 1 January 1988
- journal article
- Published by Elsevier in Microelectronics Reliability
- Vol. 28 (1), 75-92
- https://doi.org/10.1016/0026-2714(88)90328-9
Abstract
No abstract availableThis publication has 6 references indexed in Scilit:
- Assessments of micropackaged integrated circuits in high reliability applicationsMicroelectronics Journal, 1983
- Anodic gold corrosion in plastic encapsulated devicesMicroelectronics Reliability, 1983
- Failure physics of integrated circuits — A reviewMicroelectronics Reliability, 1983
- An evaluation of plastic coatings for high reliability microcircuitsMicroelectronics Journal, 1981
- Some problems and possible solutions for hybrid microcircuit reliabilityMicroelectronics Journal, 1980
- Some experiences and conclusions using soldered and welded packages for hermetic thick film hybridsMicroelectronics Reliability, 1977