A study of the wetting, microstructure and bond strength in brazing SiC by Cu-X(X = Ti,V,Nb,Cr) alloys
- 1 August 1996
- journal article
- Published by Springer Nature in Journal of Materials Science
- Vol. 31 (15), 4133-4140
- https://doi.org/10.1007/bf00352679
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Effects of the relative contents of silver and copper on the interfacial reactions and bond strength in the active brazing of SiCJournal of Materials Science, 1993
- Decomposition and interfacial reaction in brazing of SiC by copper-based active alloysJournal of Materials Science Letters, 1992
- The wetting, reaction and bonding of silicon nitride by Cu-Ti alloysJournal of Materials Science, 1991