Research on the contact resistance, reliability, and degradation mechanisms of anisotropically conductive film interconnection for flip-chip-on-flex applications
- 1 April 2003
- journal article
- research article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 32 (4), 228-234
- https://doi.org/10.1007/s11664-003-0214-z
Abstract
No abstract availableKeywords
This publication has 9 references indexed in Scilit:
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