Enhanced Cu-Teflon adhesion by presputtering treatment: Effect of surface morphology changes
- 19 October 1987
- journal article
- Published by AIP Publishing in Applied Physics Letters
- Vol. 51 (16), 1236-1238
- https://doi.org/10.1063/1.98741
Abstract
The recently observed enhancement in adhesion between Cu and Teflon due to a presputtering treatment of Teflon prior to the Cu deposition is analyzed. The sputtering treatment resulted in a morphology change of the Teflon, with the deposited Cu showing similar textures, and changes in chemical bondings between the two. A simple geometric model is used to analyze the contribution from the morphology changes to the observed peel strength. It is shown that, for a finite chemical bonding, an appreciable contribution to the peel strength is possible from the morphology changes observed.Keywords
This publication has 4 references indexed in Scilit:
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- Electron and Ion Beam-Enhanced AdhesionMRS Proceedings, 1983
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