Multichip module using multilayer YBa2Cu3O7−δ interconnects

Abstract

We report the first use of high temperature superconductors for multilayer interconnection of bare semiconductor die to form multichip modules. Ten die with a total of 160 pads were interconnected on a 3.4 cm² substrate. The interconnections were a combination of YBa₂Cu₃O_7−δ lines and vias on two wiring levels separated by an epitaxial insulating layer. Connection between the two YBa₂Cu₃O_7−δ wiring layers was accomplished by the use of superconducting vias through the insulator. Two similar multilayer multichip module designs, with 30‐ and 10‐μm‐wide YBa₂Cu₃O_δ−7 lines, were constructed.