On the formation of Ni and Pt silicide first phase: The dominant role of reaction kinetics
- 15 July 1978
- journal article
- research article
- Published by AIP Publishing in Applied Physics Letters
- Vol. 33 (2), 187-190
- https://doi.org/10.1063/1.90269
Abstract
4He+ backscattering spectrometry and x‐ray diffractometry have been used to study the formation of Ni and Pt silicides in Si(xtl)/M film structures with different metal film thicknesses ranging from 800 to 5000 Å. Results clearly show that first the phase richer in metal (Ni2Si, Pt2Si) grows and continues to grow until all available metal is reacted, then the phase richer in Si (PtSi, NiSi) starts to grow. Present results prove that in Si(xtl)/Pt or Ni interactions the growth phase is determined by the reaction kinetics and that diffusion of metal atoms through Pt2Si and Ni2Si is fundamental in keeping the reaction going.Keywords
This publication has 13 references indexed in Scilit:
- Pt2Si and PtSi formation with high-purity Pt thin filmsApplied Physics Letters, 1977
- Influence of the nature of the Si substrate on nickel silicide formed from thin Ni filmsThin Solid Films, 1976
- Silicide formation in Ni-Si Schottky barrier diodesJournal of Physics D: Applied Physics, 1976
- Selective growth of metal-rich silicide of near-noble metalsApplied Physics Letters, 1975
- Structure and growth kinetics of Ni2Si on siliconThin Solid Films, 1975
- Evaluation of glancing angle X-ray diffraction and MeV 4He backscattering analyses of silicide formationThin Solid Films, 1974
- Kinetics and mechanism of platinum silicide formation on siliconApplied Physics Letters, 1974
- Analysis of thin-film structures with nuclear backscattering and x-ray diffractionJournal of Vacuum Science and Technology, 1974
- Solid-Solid Reactions in Pt–Si SystemsJournal of Applied Physics, 1972
- LOW-TEMPERATURE MIGRATION OF SILICON IN THIN LAYERS OF GOLD AND PLATINUMApplied Physics Letters, 1971