CMOS foundry-based micromachining

Abstract
This paper reports on the first results of a study of the possibilities of the fabrication of micromechanical structures for microsystems applications in a regular MPC run of a standard CMOS process, followed by post-processing. Two post-processing modules, i.e., the frontside bulk etching module and the surface micromachining module are investigated. Examples of the former are suspended spiral coils for high-frequency applications and of the latter, metal bridge resonators.