Fabrication of micromechanical devices from polysilicon films with smooth surfaces
- 15 November 1989
- journal article
- Published by Elsevier in Sensors and Actuators
- Vol. 20 (1-2), 117-122
- https://doi.org/10.1016/0250-6874(89)87109-4
Abstract
No abstract availableThis publication has 9 references indexed in Scilit:
- Mechanical properties of fine grained polysilicon-the repeatability issuePublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Processing conditions for polysilicon films with tensile strain for large aspect ratio microstructuresPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Integrated fabrication of polysilicon mechanismsIEEE Transactions on Electron Devices, 1988
- An in situ Study of Aqueous HF Treatment of Silicon by Contact Angle Measurement and EllipsometryJournal of the Electrochemical Society, 1988
- Fine-grained polysilicon films with built-in tensile strainIEEE Transactions on Electron Devices, 1988
- Silicon and Silicon Dioxide Thermal BondingMRS Proceedings, 1987
- Wafer Bonding for SoiMRS Proceedings, 1987
- Silicon-to-silicon direct bonding methodJournal of Applied Physics, 1986
- Low-pressure chemical vapor deposition for very large-scale integration processing—A reviewIEEE Transactions on Electron Devices, 1979