Argon ion treatment of the Dow Cyclotene 3022 surface and its effect on the adhesion of evaporated copper
- 23 February 2001
- journal article
- Published by Elsevier in Applied Surface Science
- Vol. 173 (1-2), 30-39
- https://doi.org/10.1016/s0169-4332(00)00882-5
Abstract
No abstract availableThis publication has 17 references indexed in Scilit:
- The surface structure of Dow Cyclotene 3022, as determined by photoacoustic FTIR, confocal Raman and photoelectron spectroscopiesApplied Surface Science, 2000
- Interfacial reaction between evaporated copper and Dow Cyclotene 3022Applied Surface Science, 2000
- Metal/polymer interfaces with designed morphologiesJournal of Adhesion Science and Technology, 2000
- Surface modification for improved adhesion of a polymer–metal compoundSurface and Coatings Technology, 1999
- Metallization of Cu on polytetrafluoroethylene modified by keV Ar+ ion irradiationJournal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, 1998
- Effect of a Ti interlayer on the bond strength and thermal stability of the Cu/benzocyclobutene-divinyl tetramethyldisiloxane interfaceJournal of Adhesion Science and Technology, 1998
- Investigation of the Cu/BCB and Cu/PPQ interfaces by photoelectron spectroscopyJournal of Vacuum Science & Technology A, 1997
- Surface modifications of polypropylene after in-situ Ar and N2 plasma treatments: an XPS studyApplied Surface Science, 1993
- Studies on metal/benzocyclobutene (BCB) interface and adhesionJournal of Adhesion Science and Technology, 1993
- Ion bombardment of polyimide filmsJournal of Vacuum Science & Technology A, 1989