Polyimide passivation of In0.53Ga0.47As, InP, and InGaAsP/InP p-n junction structures

Abstract
Techniques for passivating In0.53Ga0.47As, InGaAsP, InP, and InGaAsP/InP pn junction structures with polyimide have been developed. Low stable leakage current is maintained for prolonged bias, even after exposure to high temperatures (∼320 °C) during packaging. 150‐μm‐diam In0.53Ga0.47As photodiodes with a breakdown voltage of ∼50 V were passivated with polyimide and were found to consistently have leakage currents of ∼10 nA at a 20‐V bias.Details of the passivation process are given.