A Ceramic Capacitor Substrate for High Speed Switching VLSI Chips
- 1 December 1982
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 5 (4), 368-374
- https://doi.org/10.1109/tchmt.1982.1136005
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
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- Thermal Conduction Module: A High-Performance Multilayer Ceramic PackageIBM Journal of Research and Development, 1982
- A Multilayer Ceramic Multichip ModuleIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1980
- IBM Multichip Multilayer Ceramic Modules for LSI Chips-Design for Performance and DensityIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1980
- Capillary-infiltrated conductors in ceramicsMetallurgical Transactions, 1971
- Controlled Collapse Reflow Chip JoiningIBM Journal of Research and Development, 1969