Study of an alkaline bath for tin deposition in the presence of sorbitol and physical and morphological characterization of tin film
- 17 December 2005
- journal article
- Published by Springer Nature in Journal of Applied Electrochemistry
- Vol. 36 (4), 403-409
- https://doi.org/10.1007/s10800-005-9086-7
Abstract
No abstract availableKeywords
This publication has 8 references indexed in Scilit:
- Study and development of an alkaline bath for copper deposition containing sorbitol as complexing agent and morphological characterization of the copper filmSurface and Coatings Technology, 2005
- Voltammetric study of the influence of EDTA on the silver electrodeposition and morphological and structural characterization of silver filmsJournal of Electroanalytical Chemistry, 2005
- Development of a sorbitol alkaline Cu–Sn plating bath and chemical, physical and morphological characterization of Cu–Sn filmsSurface and Coatings Technology, 2004
- Study of the influence of the polyalcohol sorbitol on the electrodeposition of copper–zinc films from a non-cyanide bathJournal of Electroanalytical Chemistry, 2004
- Tin-lead, lead and tin platingMetal Finishing, 1995
- Autocatalytic Deposition of TinJournal of the Electrochemical Society, 1989
- The response of some nucleation/growth processes to triangular scans of potentialJournal of Electroanalytical Chemistry and Interfacial Electrochemistry, 1983
- Limiting oxygen coverage on platinized platinum; Relevance to determination of real platinum area by hydrogen adsorptionJournal of Electroanalytical Chemistry and Interfacial Electrochemistry, 1971