Solid-state bonding of silicon chips to copper substrates with graded circular micro-trenches
- 5 April 2018
- journal article
- research article
- Published by Springer Science and Business Media LLC in Journal of Materials Science: Materials in Electronics
- Vol. 29 (12), 10037-10043
- https://doi.org/10.1007/s10854-018-9047-7
Abstract
No abstract availableKeywords
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