A 90 ns 256K x 1 bit DRAM with double-level Al technology

Abstract

A high-performance 256K /spl times/ 1bit DRAM with double-level Al technology is described. It has a small die size of 8.5 /spl times/ 4.0 mm/SUP 2/, an access time of 90 ns, and a soft error rate of less than 1000 FITs. The first and second Al layers are used as bit lines and word lines, respectively. Double-level Al technology is also applied to periphery circuit regions and contributes to a 15 percent reduction of die size in conjunction with a simplified sense-restore circuit. A compact memory cell (10.9 /spl times/ 6.1/spl mu/m /SUP 2/) with a storage capacitance of over 50 fF is obtained through the use of wafer stepping and dry etch techniques.