A scanning electron microscope study of electromigration in an Al-2% Cu thin film
- 1 May 1972
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 1 (2), 333-343
- https://doi.org/10.1007/bf02660140
Abstract
No abstract availableKeywords
This publication has 8 references indexed in Scilit:
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- Electromigration Damage in Al-Cu Thin Films8th Reliability Physics Symposium, 1971
- The effect of copper additions on electromigration in aluminum thin filmsMetallurgical Transactions, 1971
- Reduction of Electromigration in Aluminum Films by Copper DopingIBM Journal of Research and Development, 1970
- Metallization Failures in Integrated CircuitsPublished by Defense Technical Information Center (DTIC) ,1968
- Mass Transport of Aluminum by Momentum Exchange with Conducting ElectronsFourth Annual Symposium on the Physics of Failure in Electronics, 1967
- A novel method of semiconductor device measurementsProceedings of the IEEE, 1964