The energy dependence and depth distribution of lattice disorder in ion-implanted silicon
- 1 January 1970
- journal article
- research article
- Published by Taylor & Francis in Radiation Effects
- Vol. 6 (2), 181-185
- https://doi.org/10.1080/00337577008236295
Abstract
Silicon single crystals were implanted at room temperature with Xe and I ions in the energy range 20 to 150 keV and with 20 to 50 keV P ions. The lattice disorder induced by these implants was measured by a combination of the channeling and Rutherford backscattering techniques. The disorder produced by implanting I and Xe ions exhibited a similar relationship with implantation energy to that previously established for bismuth implants. The P ion implants induced less lattice disorder per incident ion in the energy range studied. Integral depth distributions of the implanted ions and of the lattice disorder were obtained by combining a layer removal technique with radiotracer implants of 110 keV 133Xe and 40 keV 32P. The depth distributions showed that in both cases the ions penetrate deeper into the crystal than the damage they produce but that the separation is significantly greater for the P implant than for the Xe implant.Keywords
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