A model for moisture induced corrosion failures in microelectronic packages
- 1 June 1990
- journal article
- research article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 13 (2), 383-389
- https://doi.org/10.1109/33.56172
Abstract
No abstract availableThis publication has 19 references indexed in Scilit:
- Non-metal hermetic encapsulation of a hybrid circuitMicroelectronics Reliability, 1988
- A Review of Corrosion Failure Mechanisms during Accelerated Tests: Electrolytic Metal MigrationJournal of the Electrochemical Society, 1987
- Anodic gold corrosion in plastic encapsulated devicesMicroelectronics Reliability, 1983
- Failure physics of integrated circuits — A reviewMicroelectronics Reliability, 1983
- Chip corrosion in plastic packagesMicroelectronics Reliability, 1980
- The Performance of Plastic-Encapsulated CMOS Microcircuits in a Humid EnvironmentIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1979
- Diffusion problems in microelectronic packagingThin Solid Films, 1978
- Nonhermeticity of Polymeric Lid SealantsIEEE Transactions on Parts, Hybrids, and Packaging, 1977
- Microcircuit Accelerated Testing Reveals Life Limiting Failure Modes8th Reliability Physics Symposium, 1977
- Some experiences and conclusions using soldered and welded packages for hermetic thick film hybridsMicroelectronics Reliability, 1977