Contact resistance and adhesion performance of ACF interconnections to aluminum metallization
- 11 July 2003
- journal article
- Published by Elsevier BV in Microelectronics Reliability
- Vol. 43 (8), 1303-1310
- https://doi.org/10.1016/s0026-2714(03)00165-3
Abstract
No abstract availableKeywords
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