Compact Heat Sink Simulations in both Forced and Natural Convection Flows
- 24 June 2002
- conference paper
- Published by American Institute of Aeronautics and Astronautics (AIAA)
Abstract
No abstract availableThis publication has 20 references indexed in Scilit:
- Characterization of compact heat sink models in natural convectionIEEE Transactions on Components and Packaging Technologies, 2002
- Pressure loss modeling for surface mounted cuboid-shaped packages in channel flowIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, 1997
- Thermal characterization of electronic devices with boundary condition independent compact modelsIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, 1995
- Effect of Flow Bypass on the Performance of Longitudinal Fin Heat SinksJournal of Electronic Packaging, 1994
- Optimization of Extruded Type External Heat Sink for Multichip ModuleJournal of Electronic Packaging, 1993
- Heat sink optimization with application to microchannelsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1992
- Thermal characterization of a PLCC-expanded R/sub jc/ methodologyIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1992
- Optimal Thermal Design of Forced Convection Heat Sinks-AnalyticalJournal of Electronic Packaging, 1991
- Representation of thermal behavior of electronic components for the creation of a databankIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1991
- Correlating equations for laminar and turbulent free convection from a vertical plateInternational Journal of Heat and Mass Transfer, 1975