Thermal characterization of electronic devices with boundary condition independent compact models
- 1 January 1995
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
- Vol. 18 (4), 723-731
- https://doi.org/10.1109/95.477457
Abstract
No abstract availableThis publication has 9 references indexed in Scilit:
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