Reduced Gold-Plating on Copper Leads for Thermocompression Bonding--Part II: Long Term Reliability
- 1 September 1977
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Parts, Hybrids, and Packaging
- Vol. 13 (3), 309-313
- https://doi.org/10.1109/tphp.1977.1135202
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
- Oxygen Embrittlement of Copper LeadsIEEE Transactions on Parts, Hybrids, and Packaging, 1977
- Interdiffusion in the CuAu thin film system at 25°C to 250°CThin Solid Films, 1977
- The Effects of Gold and Nickel Plating Thicknesses on the Strength and Reliability of Thermocompression-Bonded External LeadsIEEE Transactions on Parts, Hybrids, and Packaging, 1976
- A formalism for determining grain boundary diffusion coefficients using surface analysisSurface Science, 1976
- Strength of Gold-Plated Copper Leads on Thin Film Circuits Under Accelerated AgingIEEE Transactions on Parts, Hybrids, and Packaging, 1975
- Mass diffusion in polycrystalline copper/electroplated gold planar couplesMetallurgical Transactions, 1972