Reactive D.C. sputtering with the magnetron-plasmatron for tantalum pentoxide and titanium dioxide films
- 1 November 1979
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 63 (2), 369-375
- https://doi.org/10.1016/0040-6090(79)90042-7
Abstract
No abstract availableThis publication has 9 references indexed in Scilit:
- The role of plasmatron/magnetron systems in physical vapor deposition techniquesThin Solid Films, 1978
- Substrate heating in cylindrical magnetron sputtering sourcesThin Solid Films, 1978
- Direct current reactive sputtering of aluminiumThin Solid Films, 1978
- Magnetron dc reactive sputtering of titanium nitride and indium–tin oxideJournal of Vacuum Science and Technology, 1977
- High-rate sputtering of enhanced aluminum mirrorsJournal of Vacuum Science and Technology, 1977
- Use of the ring gap plasmatron for high rate sputteringThin Solid Films, 1977
- Film deposition with the Sputter GunJournal of Vacuum Science and Technology, 1977
- D.C. cathode sputtering: influence of the oxygen content in the gas flow on the discharge currentThin Solid Films, 1976
- Reactive sputtering of metals in oxidizing atmospheresThin Solid Films, 1973