A novel method to avoid sticking of surface micromachined structures
- 25 August 2005
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- Vol. 1, 220-223
- https://doi.org/10.1109/sensor.1995.717148
Abstract
We have fabricated surface micromachined cantilevers and bridges of 500 nm polysilicon on 900 nat thermal oxide as the sacrificial layer. It is well known that the released structures tend to stick to the substrate during the drying period after the oxide etching in HF and the rinse process. In general it is necessary to solidify the liquid between the polysilicon and the substrate. Thus we have substituted the HF in successive exchange steps by the monomer divinylbenzene. The monomer was polymerized under ultraviolet light at room temperature. Finally the polymer was released in an oxygen plasma. To prevent the fabricated structures from sticking to the substrate after an accidental touch during operation we have built bumps under the polysilicon-structures to keep them in distance from the substrate.Keywords
This publication has 8 references indexed in Scilit:
- Control of residual stress of polysilicon thin films by heavy doping in surface micromachiningPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Applications of fluorocarbon polymers in micromechanics and micromachiningSensors and Actuators A: Physical, 1994
- Adhesion of microstructures investigated by atomic force microscopySensors and Actuators A: Physical, 1994
- Mechanical stability and adhesion of microstructures under capillary forces. II. ExperimentsJournal of Microelectromechanical Systems, 1993
- Mechanical stability and adhesion of microstructures under capillary forces. I. Basic theoryJournal of Microelectromechanical Systems, 1993
- Investigation of attractive forces between PECVD silicon nitride microstructures and an oxidized silicon substrateSensors and Actuators A: Physical, 1992
- An integrated lateral tunneling unitPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1992
- Fabrication of micromechanical devices from polysilicon films with smooth surfacesSensors and Actuators, 1989