Electron microscopy analysis of the microstructure of Ti1−xAlxN alloy thin films prepared using a chemical vapour deposition method
- 1 March 1998
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 315 (1-2), 257-262
- https://doi.org/10.1016/s0040-6090(97)00706-2
Abstract
No abstract availableKeywords
This publication has 8 references indexed in Scilit:
- Crystal growth and microstructure of polycrystalline Ti1−xAlxN alloy films deposited by ultra-high-vacuum dual-target magnetron sputteringThin Solid Films, 1993
- Properties of (Ti1−xAlx)N coatings for cutting tools prepared by the cathodic arc ion plating methodJournal of Vacuum Science & Technology A, 1992
- Transmission electron microscopy studies of microstructural evolution, defect structure, and phase transitions in polycrystalline and epitaxial Ti1−xAlxN and TiN films grown by reactive magnetron sputter depositionThin Solid Films, 1991
- Phase formation and characterization of hard coatings in the TiAlN system prepared by the cathodic arc ion plating methodThin Solid Films, 1991
- Interrelationship between processing, coatingproperties and functional properties of steered arc physically vapour deposited (Ti,AI)N and (Ti,Nb)N coatingsThin Solid Films, 1990
- Comparison of cutting performance of ion-plated NbN, ZrN, TiN and (Ti, Al)N coatingsSurface and Coatings Technology, 1987
- On the structure of (Ti, Al)N-PVD coatingsJournal of Solid State Chemistry, 1987
- On structure and properties of sputtered Ti and Al based hard compound filmsJournal of Vacuum Science & Technology A, 1986