Ion back-scattering analysis of interdiffusion in Cu-Au thin films
- 1 December 1973
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 19 (2), 359-370
- https://doi.org/10.1016/0040-6090(73)90072-2
Abstract
No abstract availableThis publication has 13 references indexed in Scilit:
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