Internal stress in sputter-deposited Al2O3 films
- 1 November 1982
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 97 (4), 333-337
- https://doi.org/10.1016/0040-6090(82)90525-9
Abstract
No abstract availableKeywords
This publication has 8 references indexed in Scilit:
- Internal stress in aluminium oxide, titanium carbide and copper films obtained by planar magnetron sputteringThin Solid Films, 1981
- Residual compressive stress in sputter-deposited TiC films on steel substratesThin Solid Films, 1981
- Measurement of the intrinsic stress in thin films of silver by a new cantilevered plate techniqueThin Solid Films, 1981
- Stresses in sputter-deposited nickel and copper oxide thin filmsThin Solid Films, 1979
- The compressive stress transition in Al, V, Zr, Nb and W metal films sputtered at low working pressuresThin Solid Films, 1977
- The origin of internal stress in low−voltage sputtered tungsten filmsJournal of Applied Physics, 1975
- Aluminum films deposited by rf sputteringMetallurgical Transactions, 1970
- Some measurements of stress in thin films prepared by low pressure triode sputteringVacuum, 1969